| 摘要 |
A populated printed wiring board (PWB) (100) and method of manufacturing the populated PWB are taught. The populated PWB is manufactured by fabricating a PWB (102, 402) with exposed copper pads (302), coating the copper pads with an organic solderability preservative (OSP) (404), depositing a solder paste th at includes lead-free solder on the OSP covered copper pads (406), placing components (408) and heating the PWB above a liquidous temperature of the le ad- free solder in an air atmosphere (410). The process allows very close spacin g of components and component leads while forming reliable solder joints to components that are mechanically stressed and components that have non- negligible planarity or coplanarity tolerances. |
