| 摘要 |
PROBLEM TO BE SOLVED: To largely improve flat processing accuracy of a wafer, by eliminating a level difference and clearance of a joining part of a placing part and a support part by forming an eaves-shaped thin part overhanging to the placing part side in an upper surface inner peripheral part of the support part of a vacuum suction device. SOLUTION: This vacuum suction device has the placing part composed of a porous body having an opening air hole and the support part composed of a dense body. The device is constituted so that the placing part and the support part are substantially closely and directly joined, and the eaves-shaped thin part overhanging to the placing part side is formed in the upper surface inner peripheral part of the support part. COPYRIGHT: (C)2005,JPO&NCIPI
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