发明名称 Heat dissipating device
摘要 A heat dissipating device includes a fluid container made of a heat conductive material and having a heat-dissipating wall opposite to a heat-absorbing wall, and a surrounding wall cooperating with the heat-absorbing and heat-dissipating walls so as to confine a sealed vapor chamber. A heat exchanger member is disposed in the vapor chamber, is in heat-conductive contact with the heat-absorbing wall, and contains an amount of working fluid capable of changing into fluid vapor that fills the vapor chamber upon absorbing heat from the heat-absorbing wall. The fluid vapor is capable of changing into fluid condensate when cooled due to contact with the heat-dissipating wall. A heat-conductive cover plate is mounted spacedly on the heat-dissipating wall of the fluid container, and cooperates with the heat-dissipating wall so as to confine a heat-dissipating passage therebetween such that heat absorbed by the heat-dissipating wall is dissipated via the heat-dissipating passage.
申请公布号 US2005173096(A1) 申请公布日期 2005.08.11
申请号 US20040874434 申请日期 2004.06.22
申请人 WINCOMM CORPORATION 发明人 HSU SHIH-YING;YANG CHUNG-TER
分类号 F28D15/02;H01L23/427;(IPC1-7):F28D15/00;H05K7/20 主分类号 F28D15/02
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