MULTILAYERED CIRCUIT BOARD FOR HIGH-SPEED, DIFFERENTIAL SIGNALS

摘要

The present invention provides a multilayered circuit board (100) that can be used in high-density and high-speed electronic applications, comprising signal pad pairs (104a, 104b) for transmitting differential signals, each signal pad having a signal via (108) therein and a contact section, such that the distance between the signal via in the first signal pad and the signal via in the second signal pad is greater than the distance between the contact section of the first signal pad and the contact section of the second signal pad.