发明名称 HEAT TREATMENT METHOD FOR GROUP II-VI COMPOUND SEMICONDUCTOR SUBSTRATE AND THE SEMICONDUCTOR SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat treatment method for a group II-VI compound semiconductor substrate capable of realizing making the resistance of the substrate low without deteriorating the crystalinity, and to provide the group II-VI compound semiconductor substrate subjected to heat treatment. <P>SOLUTION: The heat treatment method of the group II-VI compound semiconductor substrate includes the steps of preparing a ZnSe substrate 10 having a front side 10a on which a semiconductor film serving as an active layer is formed, and a rear side 10b in contact with an aluminum film 9 and located opposite to the front side 10a; and applying heat treatment to the ZnSe substrate 10 in a processing chamber exposed in an atmosphere comprising Zn of a group II element configuring the ZnSe substrate 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005217153(A) 申请公布日期 2005.08.11
申请号 JP20040021481 申请日期 2004.01.29
申请人 SUMITOMO ELECTRIC IND LTD 发明人 NAMIKAWA YASUO
分类号 H01L21/22;H01L33/28 主分类号 H01L21/22
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