Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same

摘要

It is intended to reliably form high-quality via-hole conductor with less variation, and to realize a circuit forming board having excellent connection reliability. It provides a conductive paste comprising primary particles and agglomerate of primary particles, conductive particles of 0.5 to 20 mum in average particle diameter and 0.07 to 1.7 m²/g in specific surface area, and a binder based on thermosetting resin, and also provides an inexpensive circuit forming board with high connection reliability by using the paste.