发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method therefor which prevent a decrease in a yield and an increase in cost, offer high productivity, and prevent a drop in an insulation resistance or a short circuit between electrodes of chip components. <P>SOLUTION: The board (1) of a printed circuit board is provided with housings (21, 22) in which an electronic component (2) is housed. The housings (21, 22) are formed consecutively in the direction of the thickness of the board (1), and consists of a first housing (21) having a first inner surface shape, and a second housing (22) having an inner surface shape larger than the first inner surface shape. The electronic component (2) is fitted into the first housing (21) only to be housed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005216996(A) 申请公布日期 2005.08.11
申请号 JP20040019425 申请日期 2004.01.28
申请人 VICTOR CO OF JAPAN LTD 发明人 KAMIYAMA KOICHI;TAKEUCHI MAKOTO;SUGA SHINJI;KANEKO KAZUO;MICHIWAKI SHIGERU
分类号 H05K1/18;H05K3/46;(IPC1-7):H05K1/18 主分类号 H05K1/18
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