发明名称 CAPACITOR DEVICE, SEMICONDUCTOR DEVICE HAVING IT, AND METHOD FOR MANUFACTURING CAPACITOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a capacitor device whose wiring length is designed to be the shortest to reduce a parasitic inductance and can increase effect as a decoupling capacitor. <P>SOLUTION: A capacitor component 20 having a pair of terminals 20a, 20c are buried in an insulating film 16 so that its lower surface is not covered with the insulating film 16. The upper side wiring patterns 22 connected to the upper surface of the pair of terminals 20a, 20c are formed on the upper surface of the insulating film 16 respectively, through a via hole 16x formed on the insulating film 16 on the pair of terminals 20a, 20c. The lower side patterns 24 connected to the lower surface of the pair of terminals 20a, 20c are formed on the lower surface side of the insulating film 16 respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005217382(A) 申请公布日期 2005.08.11
申请号 JP20040026027 申请日期 2004.02.02
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HORIKAWA YASUYOSHI;TAKANO AKIHITO;OI ATSUSHI
分类号 H01G2/06;H01G4/40;H01L21/60;H01L21/68;H01L23/12;H01L23/498;H01L23/50;H01L27/108;H01L29/76;H05K1/02;H05K1/14;H05K1/18;H05K3/02;(IPC1-7):H05K1/18 主分类号 H01G2/06
代理机构 代理人
主权项
地址