发明名称 THERMOELECTRIC MODULE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module manufacturing method wherein a thermoelectric element is stably fixed on the soldering paste without falling down, the thermoelectric element and its supporting substrate are soldered together with high precision, and mass productivity is improved at a low cost. SOLUTION: A thermoelectric module has a supporting substrate, a plurality of n-type and p-type thermoelectric elements arranged on the supporting substrate, and wiring conductors for electrically connecting the plurality of thermoelectric elements in series. The manufacturing method comprises a step of printing the soldering paste to the wiring conductors on the supporting substrate, a step of arraying thermoelectric elements on a heat-resistant lattice-type arraying jig, a step of transferring the thermoelectric elements from the lattice-type arraying jig to the connecting conductors with the soldering paste printed thereon, a step of drying the soldering paste, and a step of heating a part or the entirety of the lattice-type arraying jig with the ends of the transferred thermoelectric elements contacting with the soldering paste. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005217055(A) 申请公布日期 2005.08.11
申请号 JP20040020286 申请日期 2004.01.28
申请人 KYOCERA CORP 发明人 FURUKAWA TOSHIHIRO
分类号 B23K3/06;H01L25/10;H01L35/16;H01L35/32;H01L35/34;(IPC1-7):H01L35/34 主分类号 B23K3/06
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