| 摘要 |
PROBLEM TO BE SOLVED: To provide a roughening copper plating solution for roughening the surface of a lead frame for surface packaging type electronic components by plating and its method. SOLUTION: The roughening copper plating solution and its plating method comprise roughening the surface of the lead frame by a roughening copper plating 3, thereby enabling to improve the adhesion power to a resin mold 1, to assure airtightness and to improve the airtightness of the surface packaging type electronic components in performing resin molding to the lead frame. COPYRIGHT: (C)2005,JPO&NCIPI |
