| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method for adequately forming a plated layer with a uniform film thickness on a main substrate, and to provide an electroplating apparatus therefor. SOLUTION: This electroplating method comprises using a pulsed power supply for a main power source 9 and a sub-power source 10, and synchronizing a pulsed current passing through between an anode 2 and the main substrate 3 with the pulsed current passing through between the anode 2 and an auxiliary substrate 4. Thereby, the method makes the auxiliary substrate 4 adequately function while the pulsed current passing through between the anode 2 and the main substrate 3, to adequately uniformize a current density on the main substrate 3, and controls the pulsed current which passes through the auxiliary substrate 4 to an OFF state while the pulsed current does not pass through between the anode 2 and the main substrate 3, to inhibit a surplus plated layer from depositing on the auxiliary substrate 4. COPYRIGHT: (C)2005,JPO&NCIPI
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