| 摘要 |
PROBLEM TO BE SOLVED: To provide a roughening treatment liquid for a copper surface for securely bonding the copper surface and a polymeric material, such as a prepreg, in manufacturing, etc., of a printed wiring board. SOLUTION: The surface roughening treatment liquid for the copper and copper alloy consists of an aqueous solution containing 1.0 to 2.5 wt.% hydrogen peroxide, 2.0 to 20 wt.% sulfuric acid, 0.2 to 0.8 wt.% benzotriazoles, and 0.0003 to 0.0015 wt.% chloride ions, and is 0.001 to 0.003 in the ratio of chloride ion concentration to the concentration of the benzotriazoles. COPYRIGHT: (C)2005,JPO&NCIPI
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