发明名称 METHOD AND DEVICE FOR MODIFYING SURFACE OF STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method and a device for modifying a surface of a structure capable of efficiently and reliably preventing occurrence of damages by modifying the surface by material improvement of an execution part through a solution treatment and by compressive stress through stress improvement. <P>SOLUTION: The method for modifying the surface of the structure comprises a solution treatment step of heating the surface of an execution part of the structure at a temperature in the range of≥900°C and≤1,100°C by the high frequency induction heating, and a step of controlling the average cooling rate to be≥30°C/sec when lowering the temperature of the surface of the execution part to 300°C from the solution treatment temperature. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005213618(A) 申请公布日期 2005.08.11
申请号 JP20040024005 申请日期 2004.01.30
申请人 TOSHIBA CORP 发明人 OBATA MINORU;KAWANO SHOHEI;SAITO YOSHIHISA;YAMAMOTO TETSUO;ISHIWATARI YUTAKA
分类号 C21D1/10;C21D9/00;(IPC1-7):C21D1/10 主分类号 C21D1/10
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