| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component receiving package and an electronic device, wherein heat generated by the electronic components can be dissipated well to the outside or atmosphere, and the electronic part can be firmly adhered to a radiation member. <P>SOLUTION: An electronic component receiving package 8 comprises a planar radiation member 1 having a mounting part 10 for electronic components 11, and a frame body 5 having a plurality of wiring conductors 6 which are attached around the mounting part 10 on the upper face of the radiation member 1 to be led out from the periphery of the inside mounting part 10 to an outer surface. In the radiation member 1, a through metal body 3 composed of copper or an alloy having copper as a main ingredient is embedded from the upper face to the lower face of the center of a frame-shaped base body 2 obtained by immersing copper in a sintered body composed of tungsten or molybdenum, and also copper layers 4a, 4b are formed so as to cover upper and lower faces of the base body 2 and the through metal body 3. In the copper layers 4a, 4b, the mean diameter of a crystal body is 5 mm or below as viewed in plan. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
