| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermal sensor capable of enhancing a reliability of an output characteristic. <P>SOLUTION: A support film 4 is formed on a whole face of a substrate 1 on which an opening is provided and a heating resistor 6 consisting of a platinum film in a predetermined pattern is formed on the support film 4, and then a protection film 5 is formed on the whole face of the support film 4 so as to cover the heating resistor 6. The substrate 1 is removed from the rear face side of the substrate 1 so as to reach the support film 4, and then a cavity 2 is formed at a lower part of a forming region of the heating resistor 6 to constitute a heating structural body 8A of a diaphragm section. Each of the support film 4 and the protection film 5 is formed from a silicon nitride film. The heating structural body 8A is formed to have a tensile stress which is not lower than 50 MPa and equal to smaller than 250 MPa. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
