| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a memory card which is strongly resistant to bending stresses by relaxing stress concentration when the bending stresses are applied to a substrate. <P>SOLUTION: An interposer substrate 2 where a semiconductor package 3 is mounted and an external terminal 4 for connecting the semiconductor package to another circuit is formed is housed in a case constituted of an upper case 5 and a lower case 6 so that a memory card 1 can be configured. An opening is formed on a line crossing a region where no semiconductor package is mounted of the interposer substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
