SEMICONDUCTOR CHIP HAVING FLIP-CHIP CONTACTS AND METHOD FOR PRODUCING THE SAME

摘要

The invention relates to a semiconductor chip (1) having flip-chip contacts (2), whereby the flip-chip contacts (2) are placed on contact surfaces (3) of the active top side (4) of the semiconductor chip (1). The contact surfaces (3) are surrounded by a passivation layer (5) that covers the active top side (4) while leaving the contact surfaces (3) exposed. The passivation layer (5) comprises thickenings (6) that encircle the contact surfaces (3). A semiconductor layer (1) of this type with thickenings (6) encircling the contact surfaces (3) is protected from delamination when packing the semiconductor chip (1) to form a semiconductor component.