| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the deviation of a lead from a terminal as much as possible at a bonding time, and to reduce the dirts of four corners of a bonding tool and its periphery as much as possible at the bonding time. <P>SOLUTION: The bonding tool 10 having a pushing part 63 which has a tip pressing surface 12 made of a hard substance for packaging a semiconductor element 20, includes a chamfered part 14 at least at the corner of the end of the output terminal 24 of the semiconductor element 20 of the tip pressing surface 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
