发明名称 |
SOLID-STATE IMAGING APPARATUS, IMAGING CIRCUIT, AND IMAGING DATA OUTPUT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus and an imaging circuit eliminating need for a cooling apparatus, being downsized and reducing the power consumption and the cost. SOLUTION: The solid-state imaging apparatus includes: a plurality of detection pixels 1 for carrying out thermoelectric conversion and photoelectric conversion and arranged two-dimensionally on a semiconductor substrate; supports 2, 3 for supporting the detection pixels 1 apart from the semiconductor substrate; a vertical shift register 4 and a buffer circuit 5 for selecting the detection pixels 1 in units of rows; a horizontal shift register 6, a column selection transistor 7 and a gate modulation amplifier circuit 8 for selecting the detection pixels 1 in units of columns; and a function selection section 11 for selecting the thermoelectric conversion or the photoelectric conversion is applied to the detection pixels 1. Since an infrared ray image or a visual light image is acquired by changing an application way of a bias to a conversion section 20 through the selection of wiring to the same conversion section, it is not required to separately provide an infrared ray sensor and a visual light sensor to each pixel. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005217629(A) |
申请公布日期 |
2005.08.11 |
申请号 |
JP20040020040 |
申请日期 |
2004.01.28 |
申请人 |
TOSHIBA CORP |
发明人 |
FUJIWARA IKUO;SHIGENAKA KEITARO;FUNAKI HIDEYUKI;NARUSE YUJIRO;IIDA YOSHINORI;SUZUKI KAZUHIRO |
分类号 |
G01J1/42;G01J5/22;G01J5/30;H01L27/14;H01L35/00;H04N5/33;H04N5/335;H04N5/369;(IPC1-7):H04N5/33 |
主分类号 |
G01J1/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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