| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing composition containing no lead, capable of sealing at a low temperature and having small coefficient of thermal expansion, where concretely, a sealable temperature is≤520°C, the coefficient of thermal expansion is≤80×10<SP>-7</SP>(1/K), and moreover a sealing temperature is≤480°C or further≤450°C. SOLUTION: The sealing composition contains no lead and comprises 80-98wt.% glass powder, 2-20wt.% inorganic filler containing zirconium phosphate compound. the glass powder has a composition containing 70-85wt.% Bi<SB>2</SB>O<SB>3</SB>, 4.5-10wt.% B<SB>2</SB>O<SB>3</SB>, 8.0-20wt.% ZnO and 0.1-1wt.% Al<SB>2</SB>O<SB>3</SB>expressed in terms of oxide. COPYRIGHT: (C)2005,JPO&NCIPI
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