发明名称 Method for repairing defects in a metallic substrate using welding
摘要 A method for repairing defects in a metallic substrate comprising the steps of placing a consumable filler slug in contact with the substrate in the vicinity of the defect; bringing a first electrode and a second electrode in contact with the consumable slug and applying a pressure to the consumable slug; and transmitting electrical current between the electrodes for a period, thereby resistively heating the consumable slug and the metallic substrate resulting in coalescence in a substantially liquid pool that fills the defect. The pool is then cooled to solidification under the pressure of the electrodes. The electrodes are then removed from contact with the consumable slug and excess material may be removed. The consumable slug may be formed as a single unit or multiple sections, and may incorporate sacrificial retainers to add additional defect filling material, retain the pool, and seal the pool from atmosphere.
申请公布号 US2005173492(A1) 申请公布日期 2005.08.11
申请号 US20040772701 申请日期 2004.02.05
申请人 WORKMAN DAVID P.;REYNOLDS JAMES L.JR.;TRAPP TIMOTHY J.;GOULD JERRY E. 发明人 WORKMAN DAVID P.;REYNOLDS JAMES L.JR.;TRAPP TIMOTHY J.;GOULD JERRY E.
分类号 B23K1/00;B23K1/20;B23K11/10;B23P6/00;(IPC1-7):B23K1/00 主分类号 B23K1/00
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