METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICK-UP DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a solid-state image pickup device for greatly improving image defects after assembly. SOLUTION: The manufacturing method of the solid-state image pick-up device comprises: a preparation process for preparing a semiconductor wafer in which a plurality of solid-state image pickup elements are formed; a dicing process for breading the semiconductor wafer into pieces by dicing; a junction process for joining each of the plurality of solid-state image pickup elements broken into pieces by the dicing process into the package; a cleaning process for cleaning the package joined to the solid-state image pick-up element; and a sealing process for sealing the solid-state image pickup element into the package by fitting the sealing member into the cleaned package. COPYRIGHT: (C)2005,JPO&NCIPI