| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module having less insertion loss. SOLUTION: The module is provided with a component 2 for high-frequency module on which a concave 8 for a waveguide tube type waveguide, and concaves 9, 10 for a shielding waveguide communicating to the concave 8 are respectively formed and short circuit columns 5, 6 are erected on a boundary portion between the concave 8, and the concaves 9, 10; and a substrate 3 disposed on one surface 4a of the component 2 so as to contact the surface, and having a ground electrode 11 for closing the concave portion 8 on a contact surface with the component 2 and TEM mode lines 12, 13 contacting the ends of the columns 5, 6 formed thereon. COPYRIGHT: (C)2005,JPO&NCIPI
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