HOLLOW PACKAGE FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a thin hollow package for storing a thin semiconductor element having moisture resistance which is more than equivalent to that of a conventional resin hollow package. SOLUTION: This hollow package for storing a semiconductor element is configured as a hollow package for a semiconductor element constituted of a resin composition and a conductive lead, and one or both of a package external bottom face and a package internal element loading face(die attach part) are provided with a metal plating layer whose thickness is 0.5μm or more and 20μm or less. The metal plating layer is functioned as a moisture non-penetration film. COPYRIGHT: (C)2005,JPO&NCIPI