发明名称 |
Method of producing printed circuit board with embedded resistor |
摘要 |
Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.
|
申请公布号 |
US2005175385(A1) |
申请公布日期 |
2005.08.11 |
申请号 |
US20040770806 |
申请日期 |
2004.02.03 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO SUK-HYUN;KANG JANG-KYU;SUN BYUNG-KOOK;HONG JONG-KUK;LEE SEOK-KYU;AHN JIN-YONG |
分类号 |
H05K3/30;B23K26/00;H01L23/12;H05K1/09;H05K1/16;H05K3/06;H05K3/10;(IPC1-7):B23K26/00;B23K26/16;B41J31/00 |
主分类号 |
H05K3/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|