发明名称 Method of producing printed circuit board with embedded resistor
摘要 Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.
申请公布号 US2005175385(A1) 申请公布日期 2005.08.11
申请号 US20040770806 申请日期 2004.02.03
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO SUK-HYUN;KANG JANG-KYU;SUN BYUNG-KOOK;HONG JONG-KUK;LEE SEOK-KYU;AHN JIN-YONG
分类号 H05K3/30;B23K26/00;H01L23/12;H05K1/09;H05K1/16;H05K3/06;H05K3/10;(IPC1-7):B23K26/00;B23K26/16;B41J31/00 主分类号 H05K3/30
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