| 摘要 |
PROBLEM TO BE SOLVED: To facilitate mounting of a photosensor having a photoelectric conversion device region on the upper surface. SOLUTION: A photosensor 11 having a photoelectric conversion device region 13 on the upper surface is mounted on a semiconductor structure 31 having a function as the peripheral drive circuit of the photosensor 11 through a solder ball 24 arranged beneath an external connection electrode 23 provided on the lower surface thereof. Even if the photoelectric conversion device region 13 and a connection pad 14 connected therewith are provided on the upper surface of the photosensor 11, the photosensor 11 is mounted without employing a bonding wire or a flexible wiring board and mounting of the photosensor 11 is facilitated. COPYRIGHT: (C)2005,JPO&NCIPI
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