| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing and shipping method of a semiconductor device capable of speed-up of cause investigation and measures at a failure occurrence time of the semiconductor device. SOLUTION: The electric characteristic of each semiconductor element 2 is measured in an electric characteristic test process 12, and the electric characteristic value is stored correlatively with the address of a semiconductor wafer 1. This semiconductor device 8 is manufactured through a dicing process 13, a chip bonding process 14, a wire bonding process 15, a resin molding process 16, and a lead frame cutting process 17, and the electric characteristic of the semiconductor device 8 is measured in an electric characteristic test process 18, and the semiconductor device 8 is classified according to a shipping address by the electric characteristic test result or by an electric characteristic test result in an electric characteristic test process 21 after storage 20 and before shipping 22. The electric characteristic of the semiconductor device 8 is stored in a storage device 24 correlatively with the address of the semiconductor wafer 1 in the classified state according to the shipping address in the electric characteristic test process 18 or 21. COPYRIGHT: (C)2005,JPO&NCIPI
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