| 发明名称 |
Semiconductor package with passive device integration |
| 摘要 |
A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.
|
| 申请公布号 |
US2005173783(A1) |
申请公布日期 |
2005.08.11 |
| 申请号 |
US20040773716 |
申请日期 |
2004.02.05 |
| 申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
CHOW SENG G.;SHIM IL K.;YING MING;AHN BYUNG H. |
| 分类号 |
H01L21/56;H01L21/68;H01L21/98;H01L23/31;H01L23/495;H01L25/065;H01L25/16;H05K3/20;H05K3/34;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
