| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mounter in which projected electrodes and wires on the semiconductor chip are never corroded even with use of a longer period of time under the severe environment of a pH sensor and a gas sensor or the like, and the wires in the part not just under the semiconductor chip on a circuit board are also not corroded. SOLUTION: The semiconductor mounter 15 is formed by providing a semiconductor chip 3 including a plurality of projected electrodes 4 in opposition to a wiring board 11 including a plurality of electrode pads 5 corresponding to such projected electrodes 4, and electro-mechanically connecting the projected electrodes 4 and the electrode pads 5 with the heating process in the pressured condition. In this semiconductor mounter 15, a base material of the wiring substrate 11 is formed of a liquid crystal polymer, one principal surface including the projected electrodes 4 of the semiconductor chip 3 is adhered to the wiring substrate 11 with a liquid crystal polymer sheet 10 for the bonding purpose, and the other surface of the semiconductor chip 3 and the wiring substrate 11 are covered with the liquid crystal polymer sheet 1 for covering purpose. COPYRIGHT: (C)2005,JPO&NCIPI
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