摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste for ceramic electronic component capable of forming external conductors having arranged planar surface shape at the end of a ceramic element while suppressing occurrence of pore or crack. SOLUTION: The conductive paste for ceramic electronic component principally comprises metal powder, glass powder and an organic binder brought into paste state by an organic solvent wherein the organic binder principally comprises iso-butyl metacrylate resin having molecular weight of 400,000-900,000 and the organic solvent principally comprises at least one kind selected from terpineol and menthanol. COPYRIGHT: (C)2005,JPO&NCIPI
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