Chip mis-position detection method

摘要

The invention includes first detection means ( 9 A) disposed on the side of a stage ( 2 ), for detecting float or peel of semiconductor chips ( 10 ) inside a horizontal or longitudinal row unit regularly arranged in an X or Y axis direction, and second detection means ( 9 B) disposed above the stage ( 2 ), for detecting the positions of the semiconductor chips in a unit horizontal or longitudinal row including the peeling semiconductor chips detected by the first detection means, and specifies the positions of the peeling semiconductor chips on the X-Y coordinate axes among a large number of semiconductor chips regularly arranged in the X and Y axes directions by using the first and second detection means while the stage is being moved in the X and Y axes directions.