| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer and double-sided substrate for achieving high-density mounting of a bump, and to provide a method for manufacturing the substrate. SOLUTION: After at least one conductive projection 1a is formed on a first flat conductive layer 3a, an insulating layer 5 in which the tip of the projection 1a is exposed is formed while the gap of the projection 1a is being buried. Then, at least one conductive projection 1b is formed on a second flat conductive layer 3b, the projection formation surface is arranged on the surface of the insulating layer, the projection 1a formed on the first conductive layer 3a and the projection 1b formed on the second conductive layer 3b are arranged opposingly so that they bite each other, and the first conductive layer 3a and the second conductive layer 3b are bonded by pressing, thus reducing distance (d) that is the pitch limit of a conventional bump interval to 1/2d, and thus easily packaging the bump with high density. COPYRIGHT: (C)2005,JPO&NCIPI
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