发明名称 MICRO RELAY
摘要 PROBLEM TO BE SOLVED: To provide a micro relay capable of maintaining the bonding of an armature substrate and a magnetic material to each other by suppressing deformation of an armature block irrespective of temperature environments during manufacture and during use. SOLUTION: A low-melting point glass a is provided between the armature substrate 30 and the magnetic material 32. In this state, heat treatment is performed to melt the low-melting glass a, followed by cooling. The magnetic material 32 is thereby bonded to the armature substrate 30 via the low-melting glass a. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005216557(A) 申请公布日期 2005.08.11
申请号 JP20040018992 申请日期 2004.01.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SADAMORI TAKESHI;HASHIMOTO TAKESHI;SHIMOMURA TSUTOMU;FURUMOTO NORITERU;OKUMURA NAOKI
分类号 H01H49/00;H01H50/04;H01H50/18;H01H51/24;(IPC1-7):H01H50/18 主分类号 H01H49/00
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