摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component transfer container which is suitably used for a transfer tray of OA equipment components such as personal computers and cellular phones having excellent heat resistance and consisting of resin having fluidity in a predetermined range, car parts, electric and electronic components, and machine parts, in particular, CCDs, semi-conductors, memories or hard disks. SOLUTION: The electronic component transfer container is constituted of thermoplastic resin in which the load-deflection temperature at the load of 18.5 kg is≥140°C, and MVR measured at 300°C and 1.2 kgf is≥1.0 cm<SP>3</SP>/10 minutes, in particular, polycarbonate copolymer consisting of 9,9 bis (4-hydroxy-3-methyl-phenyl) fluorene by 5-95 mol.% of the total of aromatic di-hydroxy, and aromatic di-hydroxy element of 95-5 mol.%, in which the copolymer of 0.7 g is dissolved in methylene chloride of 100 ml, and the specific viscosity thereof measured at 20°C is 0.21-0.45. COPYRIGHT: (C)2005,JPO&NCIPI
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