| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part sealing substrate superior in productivity, electric responsiveness and noise cut performance, when manufacturing an electronic device by airtightly sealing a microelectronic machine mechanism of a main surface of a semiconductor substrate. <P>SOLUTION: This electronic part sealing substrate 6 is composed of an insulating substrate 1 forming a wiring conductor 2 derived to the other main surface or a side surface from one main surface, a connecting pad 3 formed on its one main surface and connected with the wiring conductor 2, a frame member 4 joined to the one main surface of the insulating substrate 1 by surrounding the connecting pad 3, a connecting terminal 5 formed on the connecting pad 3 and having the same height as the frame member 4, an electronic element storing recessed part 12 formed on the other main surface of the insulating substrate 1, and an element connecting pad 13 formed inside the recessed part 12 and electrically connected to the wiring conductor 2. The substrate is constituted by airtightly sealing the microelectronic machine mechanism 8 inside the frame member 4, by joining the main surface of the semiconductor substrate 7 to the main surface of the frame member 4, by joining an electrode 9 of an electronic part 10 forming the microelectronic machine mechanism 8 and the electrode 9 connected to this mechanism on the main surface of the semiconductor substrate 7, to the connecting terminal 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
