| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing semiconductor element with which a stiffener and a radiation cover plate-low coefficients of thermal expansion can be incorporated into a wiring board without impeding packaging of the semiconductor element, and a firm and stable connection state can be maintained for long time with an outer circuit board. SOLUTION: The package for storing semiconductor element is provided with the wiring board, a semiconductor element loading part formed on one surface of the wiring board, a reinforcing frame arranged at a periphery of the semiconductor element loading part in a frame shape, and a radiation cover which is joined to the reinforcing frame and joined to the surface of the wiring board for closely sealing the semiconductor element. The reinforcing frame is formed of a structure where at least two frame boards are overlapped. COPYRIGHT: (C)2005,JPO&NCIPI |
