发明名称 |
MULTI-LAYER CIRCUIT ASSEMBLY AND PROCESS FOR PREPARING THE SAME |
摘要 |
Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included. |
申请公布号 |
EP1561368(A1) |
申请公布日期 |
2005.08.10 |
申请号 |
EP20030783214 |
申请日期 |
2003.11.07 |
申请人 |
PPG INDUSTRIES OHIO, INC. |
发明人 |
OLSON, KEVIN, C.;WANG, ALAN, E. |
分类号 |
C09D5/44;H01L21/48;H01L23/14;H05K1/05;H05K3/00;H05K3/38;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H05K3/44 |
主分类号 |
C09D5/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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