Electronic part and method of manufacturing the same

摘要

An electronic part which can be miniaturized is provided. A bottom surface of a substrate of an electronic element is positioned on the same virtual plane of an upper surface of a sidewall portion of a case body, and a seal material is covered thereon. Accordingly, a gap between the seal material and the bottom surface of the electronic element is not formed, and thus the electronic part can easily be made thin. Also, since the seal material is formed by a resin, even when positions of the bottom surface of the substrate and an upper surface of the sidewall portion are deviated, the deviation can be easily absorbed. <IMAGE>