| 发明名称 |
Power delivery apparatus, systems, and methods |
| 摘要 |
An apparatus and system, as well as fabrication methods therefor, may include a conductor attached to a carrier to bridge a contact field defined by a circuit that can be mounted to a circuit board. |
| 申请公布号 |
GB0513566(D0) |
申请公布日期 |
2005.08.10 |
| 申请号 |
GB20050013566 |
申请日期 |
2004.02.19 |
| 申请人 |
INTEL CORPORATION |
发明人 |
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| 分类号 |
H05K1/02;H05K1/14;H05K3/22;H05K3/34 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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