| 摘要 |
Heat sinks and methods particularly suited for use on packaged integrated circuits which are not amenable to the use of snap-on heat sinks and on which cemented-on heat sinks prevent conventional probing or reworking of the integrated circuit in the event trouble-shooting of the circuit is required after mounting of the heat sink. In accordance with the invention, a scalable post, based on heat sink size, mass and integrated circuit size, is cemented to the integrated circuit package in a configuration and location not interfering with the later probing or reworking of the integrated circuit, and without interfering with the printed circuit board layout. The post is then used to removably and independently hold a heat sink onto the integrated circuit so that good heat transfer between the integrated circuit and the heat sink is achieved, but still allowing the removal of the heat sink at any time if probing of the integrated circuit is later required. Alternate embodiments are disclosed. |
