发明名称 |
INTEGRATED PLATING AND PLANARIZATION PROCESS AND APPARATUS THEREFOR |
摘要 |
A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching. |
申请公布号 |
EP1560949(A1) |
申请公布日期 |
2005.08.10 |
申请号 |
EP20030783387 |
申请日期 |
2003.11.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ECONOMIKOS, LAERTIS;DELIGIANNI, HARIKLIA;COTTE, JOHN, M.;GRABARZ, HENRY, J.;CHEN, BOMY |
分类号 |
C25D5/48;C25D7/12;H01L21/288;H01L21/321;H01L21/768;(IPC1-7):C25D5/22;C25D17/00 |
主分类号 |
C25D5/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|