发明名称 METHOD OF ELECTROLESS PLATING AND APPARATUS FOR ELECTROLESS PLATING
摘要 After an additive containing a reducing agent is supplied to an object to be treated, a solution containing metal ions such as a copper sulfate solution is supplied to the object to be treated. Since the additive and the solution containing the metal ions are separated, the composition of a plating solution is easily regulated. <IMAGE>
申请公布号 KR100507019(B1) 申请公布日期 2005.08.09
申请号 KR20037010383 申请日期 2003.08.06
申请人 发明人
分类号 H01L21/288;(IPC1-7):H01L21/288 主分类号 H01L21/288
代理机构 代理人
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