发明名称 |
Wafer-level thick film standing-wave clocking |
摘要 |
An embodiment of the present invention is a technique to distribute clock. At least a metal layer is formed to have a standing-wave structure to distribute a clock signal to receiver end points from a clock source such that the receiver end points are substantially electrically equivalent with respect to the clock source. The metal layer is embedded in dielectric layers made of thick film using a wafer-level thick film (WLTF) process.
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申请公布号 |
US6927496(B2) |
申请公布日期 |
2005.08.09 |
申请号 |
US20030676958 |
申请日期 |
2003.09.30 |
申请人 |
INTEL CORPORATION |
发明人 |
BRAUNISCH HENNING;GEORGE ANNA M. |
分类号 |
H01L21/4763;H01L23/48;H01L23/522;H01L23/532;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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