| 摘要 |
Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device. According to one embodiment, a method is provided for producing a composite comprising a tested integrated circuit and an electrical device. The method can include applying a flexible elevation to a circuit substrate of the integrated circuit. Further, the method can include providing a rewiring device on the circuit substrate. The method can also include carrying out of a test of the integrated circuit with temporary utilization of the contact-making device on the flexible elevation. Further, the method can include applying solder to a contact device of the electrical device. The method can also include placing the tested integrated circuit onto the electrical device. In addition, the method can include reliquifying the solder to form a connection between the intergrated circuit and the electrical device.
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