System for testing semiconductor die on multiple semiconductor wafers

摘要

A system for testing semiconductor die on multiple semiconductor wafers includes a testing unit ( 82 ), a test fixture bank ( 84 ) operably coupled to the testing unit ( 82 ), a plurality of test fixture racks ( 86-92 ) operably coupled to the test fixture bank ( 84 ) and a plurality of wafer-interposer assemblies ( 94-140 ) operably coupled to each of the test fixture racks ( 86-92 ). Each of the wafer-interposer assemblies ( 94-140 ) includes a semiconductor wafer having a plurality of semiconductor die and an interposer coupled to the semiconductor wafer. The interposer has a first set of conductors for electrically connecting the semiconductor die of the semiconductor wafer to a substrate and a second set of conductors that electrically connect the semiconductor die of the semiconductor wafer to the test fixture rack ( 86-92 ) via a connector, thereby providing for addressing and testing of the semiconductor die.