发明名称 Method of manufacturing semiconductor device
摘要 In a method of manufacturing a capacitor, a semiconductor substrate is provided. On the semiconductor substrate, a transistor is formed. Then, a first conductive layer is formed on the substrate. An insulating layer is formed on the first conductive layer. A second conductive layer is formed on the insulating layer. The second conductive layer is patterned to form an upper electrode. Finally, the first conductive layer is patterned to form a lower electrode and a conductive pattern after the formation of the upper electrode.
申请公布号 US6927124(B2) 申请公布日期 2005.08.09
申请号 US20040856551 申请日期 2004.05.28
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 SUZUKI SO
分类号 H01L27/04;H01L21/02;H01L21/768;H01L21/822;(IPC1-7):H01L21/824 主分类号 H01L27/04
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