发明名称 Method for fabricating capacitor in semiconductor device
摘要 Disclosed is a method of fabricating a capacitor of a semiconductor device, which can produce an MIM capacitor in which an insulator film is formed to have a positive slope by means of a polymer, thereby preventing leakage of current in the capacitor. The method comprises the steps of: sequentially forming a first metal film, an insulator film, and a second metal film on a semiconductor substrate; patterning a second metal film to form an upper electrode; etching the insulator film using the upper electrode as a mask, and simultaneously forming a polymer at one side of the upper electrode; etching the insulator film which is not protected by the polymer, thereby removing the insulator film; and removing the polymer formed at said one side of the upper electrode.
申请公布号 US6927142(B2) 申请公布日期 2005.08.09
申请号 US20030705096 申请日期 2003.11.10
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE JOON HYEON;HAN SEUNG HEE
分类号 H01L27/04;H01L21/02;H01L21/20;H01L21/311;H01L21/768;H01L21/8242;(IPC1-7):H01L21/20 主分类号 H01L27/04
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