| 发明名称 |
Solution processing apparatus and solution processing method |
| 摘要 |
A plating apparatus includes a plating solution tank which stores a plating solution, a holder including an inner space to house a wafer and an opening for the wafer to be in contact with the plating solution, and a nitrogen supplying mechanism to supply nitrogen to the inner space of the holder.
|
| 申请公布号 |
US6926817(B2) |
申请公布日期 |
2005.08.09 |
| 申请号 |
US20020143014 |
申请日期 |
2002.05.13 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
MARUMO YOSHINORI;KIMURA KOICHIRO |
| 分类号 |
C25D7/12;C23C2/00;C25D17/00;C25D17/08;H01L21/00;H01L21/288;(IPC1-7):C25D5/00 |
主分类号 |
C25D7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
