发明名称 Heat absorb-release plastic resin composition and molded product thereof
摘要 The present invention relates to a heat absorb-release plastic composition and a molded product thereof, more specifically to a heat absorb-release plastic resin composition, which can sense a temperature at a specific temperature, has flexural strength, and can absorb or release heat as a latent heat, and a molded product thereof. The heat absorb-release plastic resin composition absorbs heat at a desired temperature as a latent heat and thus temperature increase is small, and therefore, it can be used for automobile interior decoration material, housing for an electric home appliances, etc. even if it has comparatively low Heat deflection temperature.
申请公布号 US6927249(B1) 申请公布日期 2005.08.09
申请号 US20040775147 申请日期 2004.02.11
申请人 LG CHEM, LTD. 发明人 LEE HEON-SANG;LEE JU-HYUNG;PARK KYUNG-MO;HWANG DUCK-KUN;KUM CHONG-KOO;KIM EUNG-SOO
分类号 C08K3/00;C08K5/01;C08L23/08;C08L23/10;C08L91/06;C08L91/08;(IPC1-7):C08K5/01 主分类号 C08K3/00
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