发明名称 |
Bond pad for flip chip package |
摘要 |
A bond pad for a flip chip package. The bond pad is suitable for an integrated circuit chip. A plurality of slots are designed in the bond pad. Each of the slots extends along a direction which is perpendicular to a radial direction from the center of the bond pad. The bond pad is deposed at the corner of the integrated circuit chip.
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申请公布号 |
US6927498(B2) |
申请公布日期 |
2005.08.09 |
申请号 |
US20030716682 |
申请日期 |
2003.11.19 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HUANG TAI-CHUN;YAO CHIH-HSIANG;HSIEH CHING-HUA |
分类号 |
H01L23/485;(IPC1-7):H01L23/29 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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